Qualcomm Snapdragon 865 and 765 will usher 5G to mainstream mobile devices in 2020 (Updated)
Qualcomm Snapdragon 865 and 765 will usher 5G to mainstream mobile devices in 2020
Earlier this year, Qualcomm publicly announced that it plans to bring 5G connectivity to its 600 and 700 series chipsets next year. True enough at this year’s Snapdragon Summit, Qualcomm revealed their roadmap to progress 5G connectivity beyond flagship devices and down to the mainstream so that many more consumers can join in the 5G bandwagon to connect, compute and communicate in more new ways to come.
- Qualcomm Snapdragon 865 mobile platform: Including the Snapdragon X55 Modem-RF system, the Snapdragon 865 will be the most advanced global 5G platform, designed to deliver unparalleled connectivity and performance for next-generation flagship devices.
- Qualcomm Snapdragon 765/765G mobile platform: This will be the mainstream mobile platform to bring integrated 5G connectivity through a built-in Snapdragon X52 modem, AI processing and Snapdragon Elite Gaming experiences.
More details to come from the following day’s keynote, but Qualcomm expects both platforms to power most of the advanced Android-based smartphones in 2020 – regardless of whether users are on 5G or 4G connectivity.
Snapdragon Modular Platforms launched
Also introduced today are the Snapdragon 865 and 765 Modular Platforms. These modular platforms are products of an end-to-end strategy to empower the industry with the tools needed to scale 5G with ease, offering Qualcomm’s customers lower development costs while also more quickly commercializing products with new industrial designs for mobile and IoT devices. The first carriers announcing support of the certification program for Snapdragon Modular Platforms are Verizon and Vodafone, while the first OEM partner taking this up is Nokia (HMD), and more partners are expected to join the bandwagon in 2020.
As seen in the following photo, there are several components that go into making the core processing platform of a smartphone. 5G also adds much more complexity and this is the reason Qualcomm is offering vendors a modular platform to help OEMs skip the various technicalities and certification, and instead focus on the product ID, UX, and other differentiated features and experiences that ride atop a trusted platform that they can rely upon.
New 3D Sonic ultrasonic fingerprint sensor
Building on the original 3D Sonic Sensor for under-display ultrasonic fingerprint technology that was first introduced with the Snapdragon 855 last year, this year sees an improved version called 3D Sonic Max. To be available on both the Snapdragon 865 and 765 mobile platforms, the latest version of Qualcomm’s ultrasonic under-display fingerprint sensor now has a recognition area of 17x larger than the previous 3D Sonic model. Error rate has also improved tremendously from 1:50,000 previously to 1:1,000,00 for far better fingerprint matching accuracy. All of this allows for increased security such as simultaneous two-finger authentication, increased authentication speed and ease of use. This is a noteworthy advancement considering how smartphone security is of paramount importance these days.
As usual, a number of working partners such as Lenovo, Nokia, Oppo and Xiaomi came to the summit to give support to the new mobile platforms that drive 5G deeper and wider. Here are some of the highlights:-
- Xiaomi’s next-gen flagship Mi 10 will be the company’s first smartphone to feature the Snapdragon 865 mobile platform along with Oppo's Find X2.
- Nokia pledged support to be one of the lead players for the Snapdragon Modular Platform and the Snapdragon 765. Xiaomi's K30
- Oppo also announced that their new Reno 3 Pro will be launching this month using the Snapdragon 765G! Xiaomi will also be joining the bandwagon with the Redmi K30.
Stay tuned to more reporting and details in the following days as the Snapdragon Summit 2019 unfolds.