Qualcomm’s X50 5G phone modem makes its first 5G network connection
Qualcomm expects the X50 5G modem family to appear in smartphones by the first half of 2019.
Qualcomm's X50 5G modem.
Previously teased at Qualcomm’s 5G summit last year, the X50 modem promised 5G network speeds. This year, the same summit brought glad tidings – Qualcomm managed to make their first 5G network connection via its X50 modem chip.
The successful 5G connection was made in Qualcomm’s San Diego labs. The X50 modem used the 28GHz millimeter wave (mmWave) antenna module to produce an over-the-air link, and it utilized several 100MHz 5G carriers.
The mmWave antenna module responsible for the connectivity.
The demonstration also utilized the SDR051 mmWave RF transceiver integrated circuit (IC), a new 5G protocol by Keysight Technologies’ and UXM 5G Wireless Test Platform.
While the testing was successful, Qualcomm did not specify the exact throughput speeds they managed to produce during the test. They did, however, say it was “more than Gigabit”, which is higher than their current 1Gbps top speeds. 5G connectivity is rated at 5Gbps, so Qualcomm (and its rivals) have a long way more to go in hitting those numbers.
The reference design used to test the new X50 modem.
Qualcomm expects the X50 5G modem family to appear in smartphones by the first half of 2019. Currently, Qualcomm’s reference design for smartphones is a 9mm-thick device with an edge-to-edge display (pictured below).
For folks who are just tuning in, your Qualcomm Snapdragon SoCs come with a mix of components and processors on board. Besides the CPU, GPU, and ISP (for task scheduling, graphics, and camera performance respectively), the SoC also packs all the necessary features for lossless audio support, LTE network compatibility, and fast-charging techniques. The rivaling Kirin 970 SoC by Huawei comes with an extra NPU for A.I.-related tasks.
Qualcomm Snapdragon 636
Qualcomm Snapdragon 636, artist depiction.
In other news, Qualcomm launched its Snapdragon 636 SoC, which is set to replace the Snapdragon 630 chipset. It boasts a 40% increase in device performance over the Snapdragon 630. The Snapdragon 636 also supports edge-to-edge FHD+ displays, sunlight-friendly and Assertive Display technology by ARM. The SoC uses a 14nm FinFET manufacturing process – within is a Qualcomm Kyro 260 CPU, Qualcomm X12 LTE modem, Qualcomm Spectra 160 ISP, and audio codec support via Qualcomm Aqstic.
The Qualcomm Snapdragon 636 is expected to ship to phone makers come November 2017.
Source: Qualcomm
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