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Intel targets entry-level markets with Atom x3 processors, celebrates innovation in Asia

By Koh Wanzi - on 24 May 2015, 6:24pm

Intel targets entry-level markets with Atom x3 processors, celebrates innovation in Asia

At its Intelligent Design showcase event in Penang, Malaysia, Intel unveiled plans to take on the entry-level mobile device market with its Intel Atom x3 SoCs. We already know the Atom x3 processors by a different name – back at IDF 2014 Shenzhen, Intel demonstrated its first mobile SoCs built for entry and value devices, codenamed SoFIA (Smart or Feature Phone with Intel Architecture).

The Intel Atom x3 processors are the product of Intel Mobile Communications in Singapore, formerly the Wireless Solutions division of German semiconductor manufacturer Infineon. The Atom x3 chips are low-cost 64-bit SoCs featuring an application processor and integrated modems available in 3G, 3G-R and LTE versions.

The Intel Atom x3 processors are designed to give Intel a foothold in the ultra-low cost segment of the mobile market.

With the Atom x3 processors, Intel now has chips targeted at all segments in the mobile market, ranging from the ultra-low cost market to the performance segment. Intel Atom x5 and x7 chips – which don’t feature integrated modems – and Core M processors comprise the mid- and high-end segments of the market respectively.

Intel has processors catering to all segments of the mobile market.

In addition to giving Intel an entry into the highly price-sensitive budget mobile market, the Atom x3 SoCs enable manufacturers to create phones and tablets that deliver reasonable performance and good battery life at low prices.

Intel also hopes that its Atom x3 processors will find their way into connected devices. The growing ubiquity of IoT devices calls for lower costs, something which Intel’s budget SoCs are poised to deliver.

Available in either dual- or quad-core variants, the Atom x3 chips will ship in the form of three different SKUs. For more details on the individual processors, please refer to our earlier coverage here.

Intel also took the opportunity to showcase the advancements of its fifth-generation Broadwell processors. Asia was very much the focus of Intel’s keynote address. Like the Intel Compute Stick which was developed almost entirely in Malaysia, Broadwell’s design owes a large part to the work done at Intel’s Malaysia Design Center.

Intel 5th-generation Core processors have enabled more innovative and advanced form factors and designs.

According to Intel, its 5th-generation Core processors have enabled a variety innovative, exciting and diverse form factors. For instance, Intel’s Core M processors have enabled slim, fanless designs in ultra-portable devices like the ASUS Transformer Book T300 Chi and the Lenovo Yoga 3 Pro.

Intel showcased the unique form factor and capabilities of the ASUS Transformer Book T300 Chi, a 2-in-1 hybrid powered by Intel's Core M processor.

The chipmaker also showcased its RealSense 3D camera technology, which promises new applications like more immersive gaming experiences and more secure authentication methods via facial recognition.

The RealSense 3D camera technology can enable more immersive gaming experiences, among other applications.

With Asia-Pacific and Japan set to become the second largest mobile market by 2020, it seems apt that so much of Intel’s innovation in the mobile space is taking place here in Asia. Devices powered by Intel’s 5th-generation Core processors are already available now from major brands like ASUS, Acer, Dell and Lenovo. Atom x3-powered smartphones are expected to be available later this year.

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