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Image source: Intel

Intel announces three new chip packaging technologies to build computing systems of the future

The new processors integrate the CPU, GPU, and HBM2 memory on the same package. (Image Source: Intel)

Intel’s Core G-series mobile chips with Radeon RX Vega M graphics will usher in a new breed of powerful ultraportables

8 Jan 2018

A 3D render of what the new processor module may look like. (Image Source: Intel)

Intel’s 8th-generation mobile processors will feature discrete graphics from AMD

7 Nov 2017

Image Source: Intel

Intel CPUs of the future could ‘mix and match’ different parts on the same package

5 Apr 2017