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Image source: 3M.

3M, SGI & Intel Showcase Advanced Cooling Technology for the "Data Center of the Future"

Image source: 3M Touch Systems

3M Previews 84-inch Multi-touch Display at CES 2013

11 Jan 2013

The glue, shown in blue above, connects up to 100 separate chips as it conducts heat away from the silicon package. Chips in a stacked configuration would allow for better system-on-a-chip (SoC) compatibility by combining processing, networking and memory subsystems on a single die.

IBM and 3M to Develop Adhesives to Build Stacks of Semiconductors

8 Sep 2011

3M Introduces Natural View Screen Protectors for Apple iPad and Mobile Phones Along with Mobile Privacy Film

4 Mar 2011