Kingston celebrates the 10th anniversary of its HyperX product line at CES 2013 by releasing a special anniversary edition memory module.

According to Micron, DDR4 memory will be available for devices as early as next year. The company expects to begin volume production by the end of this year.

OWC announced that its MaxRAM tested and verified compatible OWC DDR3 1333MHz 16GB Memory Upgrade Kit supercharges 2011 Apple MacBook Pro and Mac mini models by doubling the Factory maximum offered memory.

Arctic presents G-1, a thermal glue designed to replace the typical thermal tapes for affixing RAM and VR heatsinks.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products, today expanded the product lineup of their recently announced Viper Xtreme Series of DDR3 memory solutions.

Realizing the importance of heat dissipation on a memory module, KINGMAX releases the HERCULES DDR3 2200 with nano thermal dissipation technology applied to the DRAM module. Without a heatsink, this DRAM module is also lighter and slimmer, which frees up space within a computer case to improve air circulation and help stabilize system operations.

Kingston today announced the release of HyperX 'H2O' water-cooled DDR3 dual- and triple-channel memory kits.

Walton Chaintech announces the availability of its latest memory clock that can reach a memory speed of 2400MHz.