Qualcomm launches AI-powered Wi-Fi 7 chip, FastConnect 7900, at MWC 2024

At Mobile World Congress (MWC) 2024 today (26 February 2024), Qualcomm Technologies Inc. announced the Qualcomm FastConnect 7900 component, its next-generation all-in connectivity solution for phones.

The 6-nanometre FastConnect 7900 platform grants access to the latest connectivity technologies like Wi-Fi 7, Bluetooth 5.4, Ultrawide Band (UWB), and several proprietary connection perks unique to Qualcomm-back products.

A key feature of the new connectivity platform is an all-new AI optimisation built for efficient and fast Wi-Fi 7 connections, on top of new RF FEMs (radio frequency front-end modules) that grant additional power and longer battery uptimes to the phones using the FastConnect 7900.

FastConnect 7900 supports 6GHz, 5GHz, and 2.4GHz bands, with up to 5.8Gbps data rate thanks to its 4K QAM modulation and a total 320MHz channel bandwidth (160+160 with High Band Simultaneous Link). In English, this means it can tap into multiple streams of 5/6GHz channel bandwidth on the Wi-Fi spectrum to deliver insanely fast wireless speeds.

Qualcomm also said that the FastConnect 7900 has 40% lower power usage than previous generation Wi-Fi chips it has designed.

As a Qualcomm-designed component, FastConnect 7900 supports its proprietary audio transmission technologies, like Snapdragon Sound and Qualcomm XPAN. The former makes audio transmissions less power-hungry, while the latter makes 192kHz wireless lossless audio streaming a possible feat.

Other perks it supports are Bluetooth 5.4, spatial audio, ANT+, and Bluetooth LE Audio. Audio playback profiles that are native to FastConnect 7900 include Qualcomm aptX Lossless, Qualcomm aptX Adaptive, and Qualcomm aptX Voice.

Qualcomm has a MWC 2024 booth in Barcelona, Spain, over at the Fira Gran Via in Hall 3, Booth 3E10.

Source: Qualcomm

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