Sony Develops Silicon Sheet that could Replace Thermal Paste
Applying thermal paste may be a thing of the past as Sony demonstrates its new silicon sheet that is touted to have better cooling properties than thermal paste.
Applying thermal paste may be a thing of the past as Sony demonstrates its new silicon sheet that is touted to have better cooling properties than thermal paste.
(Image Source: Tech-On)
According to Tech-On, Sony revealed a prototype of a silicon and carbon-based thermal sheet currently known as "EX20000C" last week in Tokyo, Japan. The sheet measures 0.3 - 2.0mm in thickness and has a thermal resistance of 0.4 - 0.2K cm2/W. This marked an improvement over its previous solution.
Sony claims that the EX2000C exceeds the thermal conductivity of standard thermal grease. During its demonstration on the show floor, the company showed that a CPU with the thermal sheet applied was cooler by three degrees Celsius than another was had thermal paste applied. The details of the demonstration were not shared, like the specifications of the CPUs, the type of cooling solution and the brand of the thermal paste used.
The other advantages offered by the EX2000C are the its longer lifespan as they do not degrade easily and they are easier to apply without creating any unnecessary mess. Sony expects the new sheet to be used in high-end servers, projectors and other such equipment. Readers are advised not to start throwing out their tubes of thermal paste as it is not known when the EX2000C will be commercially available and how much it would cost.
(Source: Tech-On)
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