Silicon Power Presents New Gen Xpower DDR3 Memory Module

Built in a special-made metallic heat sink, the new Xpower DDR3 has the ability to increase the heat dissipation area, maintaining a powerful speed and stability to meet the needs of overclocking enthusiasts and hardcore gamers.

Silicon Power unveils the new generation of Xpower DDR3 Overclocking series memory module. Built in a special-made metallic heat sink, the new Xpower DDR3 has the ability to increase the heat dissipation area, maintaining a powerful speed and stability to meet the needs of overclocking enthusiasts and hardcore gamers.

Image source: Silicon Power.

Image source: Silicon Power.

Available in dual channel kits in DDR3-1600, 1866, 2133, and 2400 MHz variants, the new series is compatible with the Intel Ivy Bridge and Z77 platforms, maximizing transfer speeds and making it ideal for gaming, as well as photo and video editing.

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