Samsung begins mass production of world's thinnest LPDDR5X DRAM for on-device AI

Samsung has announced what it claims is the industry's thinnest 12nm class LPDDR5X DRAM chip. It is designed specifically for the lower-power RAM market, particularly for smartphones with on-device AI capabilities

YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, said:

Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package.

The South Korean company is able to achieve this feat by optimising the printed circuit board (PCB) and epoxy moulding compound (EMC)² techniques. In addition, Samsung's optimised back-lapping process is used to minimise the package height. 

The 12nm class LPDDR5X DRAM chip is stated to be as thin as a fingerprint at just 0.65mm. Compared to the previous generation product, the new LPDDR5X DRAM is thinner by 9% and its heat resistance is enhanced by about 21.2%.

Heat management is one of the biggest issues in mobile devices these days. Because of a lack of fans, these devices are cooled passively. Thinner memory components can help by creating more space within the devices thereby promoting better airflow and thermal management. Samsung says this is extremely beneficial for high-end devices with on-device AI.

Samsung says it will supply the new LPDDR5X DRAM to mobile processor makers and mobile device manufacturers. Mass production has begun for the 12GB and 16GB LPDDR5X DRAM chips. It plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.

Source: Samsung

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