News tagged ‘memory’
Tuesday, 4 Jun 2013
Besides introducing its Carbide Air 540 and Carbide 330R chassis, Corsair has also announced the Vengeance Pro Series of high-performance DDR3 computer memory, at the Computex 2013.
Wednesday, 3 Apr 2013
The Hybrid Memory Cube Consortium (HMCC) has announced its new DRAM memory architecture, called the Hybrid Memory Cube (HMC) technology, which is touted to improve performance over standard DDR3 and DDR4 DRAM while simultaneously reducing power consumption.
Tuesday, 8 Jan 2013
Kingston celebrates the 10th anniversary of its HyperX product line at CES 2013 by releasing a special anniversary edition memory module.
Wednesday, 5 Dec 2012
Apacer introduces their new ARMOR Series DDR3 overclocking memory modules with colors to match users' motherboards.
Thursday, 18 Oct 2012
Patriot Memory has announced its new ULP (ultra-low power) Memory for Ultrabook SODIMM modules, offering users an option to upgrade their ultrabooks for increased performance and productivity.
Monday, 10 Sep 2012
Kingston has introduced its all-new packaging for the system-specific memory modules for ASUS and Acer notebooks.
In light of the ongoing trial against Samsung, it is rumored that the first batch of the highly anticipated new iPhone (scheduled to be announced this Wednesday) will not use Samsung memory chips.
Friday, 31 Aug 2012
Kingston has just announced that their HyperX red series is now a permanent addition to the entry-level HyperX blu product line, and not just a limited edition offering. These heatspreaders allow greater heat dissipation to help maintain optimal system performance.
Friday, 17 Aug 2012
Kingston just announced its updated HyperX Predator DRAM modules. The updated series boasts of memory kits of larger capacities and each module features a newly designed heatspreader. With support for Intel XMP 1.3 and higher rated frequencies, the HyperX Predator series is primed for top performance.
Friday, 3 Aug 2012
Samsung has just announced the production of ultra-fast embedded memory for smartphones, tablets, and other mobile devices. It is the first chip maker to support the latest JEDEC e-MMC v4.5 specification that standardizes more features for enhanced performance, efficiency, security, and reliability.