KINGMAX Introduces HERCULES DDR3 2200 DRAM Module with Invisible Heatsink

KINGMAX Introduces HERCULES DDR3 2200 DRAM Module with Invisible Heatsink


8th August, 2010, Taipei - When a system's inner temperature is excessively high, component damage and system crashes are likely to occur in a computer. As such, DRAM modules with exceptional thermal performance becomes an important factor to ensure a computer system is able to run stably. Realizing the importance of heat dissipation for a DRAM module, KINGMAX has applied nano thermal dissipation technology to a DRAM module, and thereby introduces the HERCULES DDR3 2200 to the market. Benefiting from this technology, users will soon realize a heatsink is no longer necessary for DRAM module; since a lightweight and slim DRAM module can also offer an incredible thermal dissipation performance as well. 

Judging by its appearance, the HERCULES DDR3 2200 might appear similar to a normal DRAM module, but the “invisible layer” on it is all that matters. To test the thermal dissipation performance for the DDR3 2200, we conducted an experiment comparing three different memory modules 1) DRAM module equipped with ordinary heatsink; 2) DRAM module equipped with KINGMAX heatsink , and 3) HERCULES DRAM module with no heatsink. They were tested on an overclocking (2200 MHz) test program. The result revealed that the ordinary module caused the system to crash various times due to poor thermal performance. Yet, the other two exhibited excellent performance as their test PCs showed no error messages. 

With great compatibility, stability, and overclocking performance, KINGMAX full-series DRAM modules are favored by computer players. This year, KINGMAX once again takes the innovative approach to apply the latest nano thermal dissipation technology on the products and introduces the HERCULES DDR3 2200 MHz dual channel DRAM modules. Its high-speed transmission bandwidth enables it to reach 17.6 GB/sec and brings overclocking enjoyment to gamers. Without a heatsink, it becomes lighter and slimmer, which also frees up space within a computer case to improve air circulation and stabilize system operations. On the other hand, by getting rid of heatsink, the product cost is similarly reduced. For consumers, the KINGMAX HERCULES DDR3 2200 DRAM module offers a high overclocking frequency, superior thermal performance, and is truly affordable. 

Features of KINGMAX HERCULES DDR3 2200:

  • Support Intel P55 Chipset
  • Adopting Nano Thermal Dissipation Technology
  • ASIC chip embedded for anti-counterfeiting purpose
  • Lead-free production process
  • TinyBGATM technology adopted: with advantages as compact size, well heat dissipation and low EM interference
  • 100% product compatibility and stability
  • High data transfer performance for overclocking enthusiasts and hardcore gamers

Specification of KINGMAX HERCULES DDR3 2200:

  • 240-pin DDR3 2200MHz 
  • CAS Latency: 10
  • Bandwidth: 17.6GB/sec
  • Voltage: 1.5~1.8v
  • Capacity: 4GB (2GB*2)
  • Worldwide lifetime warranty

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