News
News Categories

Intel sets sights on IoT devices and unveils Intel Mass Makerspace Accelerator Program at IDF 2015

By Koh Wanzi - on 8 Apr 2015, 1:59pm

Intel sets sights on IoT devices and unveils Intel Mass Makerspace Accelerator Program at IDF 2015

Intel CEO Brian Krzanich is joined on stage by Rockchip CEO Min Li at IDF 2015 in Shenzhen, China. (Image Source: Intel)

The Intel Developer Forum (IDF) kicked off today in Shenzhen, China, with several key announcements regarding Intel’s plans for mobile and connected devices and its strategy for driving innovation and entrepreneurship in China and beyond.

Intel CEO Brian Krzanich took to the stage with a keynote address, promising to deliver value across a range of industries to create a smarter, more connected world. “Intel remains focused on delivering leadership products and technologies in traditional areas of computing, while also investing in new areas and entrepreneurs – students, makers and developers – to find and fuel future generations of innovation in China,” said Krzanich.

Following up on its announcement at IDF 2014 Shenzhen to focus on the Internet of Things (IoT), Intel revealed that it will be extending its Intel Atom x3 processor roadmap to the IoT with the addition of 3G and LTE processors. The new processors will be able to operate in an extended temperature range and support Linux and Android operating systems. Products based on the Intel Atom x3-C3230RK quad-core processor reference design from Rockchip are already in the works, with devices expected to be out in the market as soon as later this quarter. In addition, more than 45 tablet, phablet and smartphone designs are currently in development based on Intel Atom x3 processor reference designs.

The Intel Atom x3 processor is Intel’s first integrated SoC featuring 3G or 4G (LTE) modems. (Image Source: Intel)

Building on the expansion of its Atom x3 processors into IoT, Intel is also opening an IoT lab in Beijing. The lab will be operated jointly by Intel, the Strategic Alliance of Smart Energy Industrial Technology Innovation and ecosystem partner BII Group. The lab will help promote solutions based on Intel’s technology and build up a comprehensive ecosystem of connected devices.

Intel also announced that the recently-unveiled 14nm Braswell SoCs are now shipping to customers for 2-in-1 devices, laptops, tower and miniature desktops, and all-in-one PCs. The new Celeron and Pentium chips balance cost, performance and power, and are optimized for the value and entry-level markets.

In addition, Intel is marking its 30 years in China with the Mass Makerspace Accelerator Program which aims to turn China’s budding innovators into the next global entrepreneurs. Intel has cast the net wide to include everyone from makers and students to developers and business startups, and will be backing the program with a RMB120 million investment.

IDC has predicted a total of 50 billion IoT devices by 2020, and if recent developments are anything to go by, Intel is on track to make that happen.

Source: Intel

Join HWZ's Telegram channel here and catch all the latest tech news!
Our articles may contain affiliate links. If you buy through these links, we may earn a small commission.