Huawei Unveiling Ultra Slim P Series Smartphone at MWC 2013


Huawei Unveiling Ultra Slim P Series Smartphone at MWC 2013

 

Huawei is adopting a very aggressive stance this year. At CES 2013, the Chinese company took the limelight with the 6.1-inch Ascend Mate and joined the 5-inch party with its Ascend D2. Looking forward, Huawei has plans to topple the competition with its upcoming products which include a custom designed 8-core processor and an ultra sleek P series smartphone. 

Richard Yu, Huawei's Consumer Business Group CEO revealed to Engadget that the company will be releasing an 8-core processor in the second half of 2013. Dubbed the HiSilicon K3V3, the processor will be based on the more powerful Cortex A15 architecture. Huawei will compete against the likes of Samsung's next generation Exynos 5 Octa processor and NVIDIA's Tegra 4.

Huawei will also be gunning for the title of the world's thinnest smartphone, which is currently held by the 6.45mm thin Alcatel One Touch Idol Ultra. Yu told Engadget that the P series smartphone will make its debut at next month's MWC 2013 with a metallic chassis.

We reviewed the Huawei Ascend P1 last September and found it to be a well-rounded midrange Android smartphone. The Ascend P1 won us over with its sleek design, excellent AMOLED display, solid overall performance and affordable price tag. As for the new P series smartphone, we certainly have high expectations for it.

Source: Engadget (1) (2)

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