Taipei, Taiwan – Cooler Master recently unveiled an industry first in CPU cooling, the TPC 812 CPU Cooler. This model delivers an impressive air cooling performance, thanks to two vertical vapor chambers. It is touted as the first CPU heatsink to combine vertical vapor chamber technology with heatpipe technology, and is fully capable of handling the massive heat loads generated by overclocked multi-core CPUs.
The TPC 812 possesses a 100% polished pure copper base, combined with improved solder reflux techniques to further increase its thermal transfer capabilities. Its heatsink fin design and improved fan mounting system makes it perform even better than some all-in-one (AIO) liquid cooling units. This CPU cooler's bundled fans have been tweaked for ideal noise airflow and air pressure, allowing it to be efficient and silent.
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