The 13.3-inch ASUS ZenBook Flip UX360 convertible laptop is now available in Singapore! Besides its slim and stylish appearance, check out what else this latest ZenBook variant from ASUS has to offer.
Tech News Leaked: Pictures and benchmark results of the upcoming Intel Core i7-6850K “Broadwell-E” CPU
Some photographs and benchmark scores of the upcoming Intel Core i7-6850K "Broadwell-E" CPU was leaked on a message board. Find out more what this new enthusiast-grade LGA2011-v3 processor has to offer.
Intel has announced the cancellation of its upcoming Atom SoCs for smartphones and tablets, codenamed Broxton and SoFIA. After coughing up over US$10 billion to play catch-up in the mobile space, Intel is finally cutting its losses (although it is not exiting the mobile market entirely).
Intel has detailed a proposal for a new USB-C Digital Audio standard, which would replace the analog 3.5mm audio jack and help complete the shift from analog to digital.
ASRock has unveiled details on the DeskMini, an ultra-compact PC that features Intel's new mini-STX motherboard form factor. This allows it to support socketed desktop CPUs, making it the first system of its size to allow users to upgrade their processor.
Intel has announced that it will be cutting 12,000 jobs, amounting to about 11 percent of its workforce. The company plans to use the cost savings from the restructuring to invest more in growth areas like its data center and IoT businesses.
Now, you can delid your Intel CPU with the Rockit 88 Intel CPU delid tool. However, only PC enthusiasts need apply; more details after the jump!
Intel has formally unveiled its next-generation Apollo Lake platform for upcoming Atom-based notebooks at IDF 2016 in Shenzhen, promising more powerful and thinner budget devices with support for things like USB Type-C and hardware-based 4K video playback.
Intel has announced the SSD 540s and SSD Pro 5400s drives for consumers and businesses respectively. Both SSDs are the first from Intel to utilize 16nm TLC NAND and will be available in 2.5-inch and M.2 form factors in capacities up to 1TB.
Keen eyes at the Motley Fool have picked up on a pertinent point in Intel’s annual financial report to the US Securities and Exchange Commission (SEC). The chip manufacturer expects to stretch its current and next generation fabrication processes beyond its familiar tick-tock cycle.