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Reports have surfaced that the new Intel Skylake CPUs and LGA 1151 motherboard sockets can be damaged by excessive pressure applied by third-party CPU coolers. Intel is investigating now.
Intel has launched its 2nd generation Xeon Phi coprocessor, codenamed Knights Landing. The company also officially announced the Omni-Path Architecture, its new, proprietary interconnect technology. Read on for more details.
Sporting a new color, the ASUS ZenBook UX305 Ultrabook also now features the latest 6th gen-Intel "Skylake" mobile CPUs. More details on its pricing and specifications after the jump!
Remember Intel Curie? It’s the company’s low-powered chip that will make its debut on the upcoming Arduino 101 development board. More details after the jump!
Intel is said to have assembled a team of more than 1,000 people to work on its XMM 7360 modem for future Apple iPhone models. If Intel continues to meet Apple's expectations, the former may have the opportunity to manufacture the next iPhone processor.