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3M has announced the implementation of a fully functional supercomputer developed in collaboration with Intel and SGI that uses a revolutionary two-phase immersion cooling technology pioneered by 3M.
Targeting entry level and value segments, Intel unveiled and demonstrated the new SoFIA 3G mobile SoC integrated with the 64-bit Atom processor. Would these new SoCs be low cost enough to bring about a new range of low-cost Android smartphones?
With up to 50 billion Internet of Things devices installed in the world by 2020, Intel is working aggressively to bring its familiar x86 architecture into the IoT and wearables world. Today at IDF 2014 in Shenzhen, China, Intel CEO unveiled new products and solutions to drive the growth of IoT.
Intel has announced the extension of Intel Edison to a family of development boards. The key development is the use of a 22nm Intel Silvermont dual-core Atom SoC to replace the Quark SoC. Initially, Intel said the Edison development board was supposed to be based on the latter.
The Intel Ready Mode technology enables the desktop PC to be always powered on with as little as 10W. This is achieved by leveraging on the C7 idle states of the 4th generation Intel Core CPU, power optimization design of the motherboard, and customized software.
Intel has revealed the new 5th generation of unlocked Intel Core “Broadwell” processors will feature the Iris Pro graphics that was previously exclusively to mobile SKUS of the previous generation Intel Core CPUs. In addition, the Broadwell chips will be based on the new 14nm fabrication process.
Intel’s new MXC fiber optics cable is touted to offer data transfer rates of up to 800Gbps. The MXC cable is jointly developed by Intel, Corning, and US Conec, with the aim of replacing current 10Gbps interconnect cables used in data centers and supercomputing setups.