Toshiba and Western Digital begin shipping world's first 64-layer 3D NAND
Toshiba and Western Digital begin shipping world's first 64-layer 3D NAND
Toshiba and Western Digital, through its new acquisition SanDisk, have jointly announced the world's first 64-layer BiCS FLASH 3D NAND.
The new NAND uses 3-bit-per-cell technology and has a memory density of 256Gb. This will enable capacities of up to half a terabit on a single chip.
The roadmap for BiCS FLASH indicates that the next product will continue to have 64-layers, but will see memory density boosted to 512Gb.
According to Toshiba and Western Digital, their latest generation of BiCS FLASH will provide a 40% increase in capacity per chip size and reduce cost per bit, which will enable even more affordable flash storage devices.
Finally, Toshiba has said that it will produce the new 64-layer BiCS FLASH at the new Fab 2 facility at Yokkaichi Operations, Japan, which was officially opened earlier this month.
Mass production of 64-layer BiCS FLASH is expected to begin in the first half of next year.
Source: Toshiba, Digital Trends