Micron Technology has unveiled its new single-sided DDR3 DRAM module that has a reduced height of only 3mm. This translates to a 35% reduction from the standard DDR3 SODIMM. The new single-sided DRAM module also features DDR3L-RS components for lower power consumption.
The company is targeting the manufacturing market for Ultrabook devices, convertibles, tablets and other thin and light devices. Currently, its single-sided SODIMM is available in a 4GB, single-rank, x8 configuration. It is also pin-to-pin compatible with current DDR3 SODIMMs and backward compatible with DDR3 SODIMM connectors. Their samples are available now and Micron aims to mass produce them as early as March this year
(Source: Micron Technology)