Intel revealed design plans of its new 22nm system-on-a-chip (SoC) that will feature 3D Tri-gate transistors, in line with their Ivy Bridge counterparts. The company outlined this new microarchitecture for its SoC in a paper presented at the 2012 International Electron Devices Meeting (IEDM).
According to Intel, the upcoming SoC will use the same 22nm fabrication process and 3D Tri-gate transistors as the original flagship processors, there is an emphasis on power savings for the former; in that the existing microarchitecture will be further enhanced for low-power devices, by incorporating “...low standby power and high voltage transistors together with high-speed logic transistors...” on a single silicon package that is able to support a wide range of devices ranging from smartphones, tablets, netbooks to embedded systems.
One of the earlier beneficiaries of this new fabrication technology will the 22nm Atom SoC and it is rumored to be ready for high volume production during the second half of 2013. Intel had actually revealed its 22nm design plans earlier this year at IDF 2012 in a keynote address by David 'Dadi' Perlmutter who is the Executive Vice President of Intel. According to PCMag, the Intel engineers delved into more technical details during their presentation at IEDM 2012.