Intel Begins Shipping LTE-Capable XMM 7160 Chip to Manufacturers
Intel has begun shipping its LTE-capable XMM 7160 chip to manufacturers. Demonstrated in June this year at Computex 2013, the XMM 7160 slim modem platform supports 15 global LTE bands, as well as 2G, 3G and voice-over-LTE services.
Due to the platform's ability to support 15 global LTE bands simultaneously, it will allow devices to work across multiple bands, ensuring compatibility with various LTE networks. This feature will allow for seamless 4G roaming in the future.
Intel has introduced the new modem platform in the form of a PCIe M.2 module. For manufacturers, the "M.2 module makes it simple to add 4G connectivity to their designs while reducing integration and certification expenses, and improving time-to-market." According to Engadget, the modules have already made its way into devices, most notably the Samsung Galaxy Tab 3 (10.1) that is currently shipping to Europe and Asia. The modules will also make their inroads to Bay Trail tablets soon.
In 2014, Intel plans to launch next generation LTE solutions, including the Intel XMM 7260 modem with more advanced features like "carrier aggregation, faster speeds and support for both TD-LTE and TD-SCDMA." Please click here for the official press release from Intel.