At the IDF13 keynote this morning, Intel CEO, Brian Krzanich, unveiled the company’s next generation LTE modem, the Intel XMM7260, that comes with LTE-Advanced features such as carrier aggregation. Preparing for the next generation telecommunication standard, Intel is expected to ship the new modem along with its next generation range of Atom SoCs, codenamed 'Merrifield', in 2014. Demonstrating the modem’s new feature to a packed audience, he showed how it was able double its data throughput from 35Mbps to 70Mbps. Intel is confident that they will be able to further improve its speed to 150Mbps in the near future to meet the demands of bandwidth hungry users and applications.
Besides that, Intel further established its leadership in silicon manufacturing with the first demonstration of a 14nm next generation 'Broadwell' Intel Core processor running in an ultrabook PC. The new processor will begin shipping end of this year to Intel's customers and will be available in products in early 2014. According to Krzanich, the new Broadwell processor will consume up to 30% less power than current generation Core (Haswell) processors. However, they expect to get the power envelope down further as they are not done tuning the processor at this point. Besides allowing OEMs to build ultrabooks with slimmer form factor and longer battery life, ultra low voltage Broadwell parts is expected to enable more fanless laptop designs.