AMD's upcoming Zen CPUs and APUs will both share the same socket, clearing the way for users to upgrade from an entry-level build to a high-end PC.
Samsung could join GlobalFoundries in helping AMD manufacture its next generation of 14nm chips in 2016.
At long last, the final judging event for Intel's Invent 50 competition has concluded. Whether it's amphibious drones, autonomous security robots, or medical technology, the finalists have got it all covered. Which team will walk away with S$10,000 and an internship with Intel?
Thanks to ASRock's Sky OC BIOS update, we may be on the cusp of a return to the good old days when nearly any processor could be overclocked by ratcheting up its base clock.
It's still early days, but there are suggestions that AMD's 2016 products could face delays that would push them back to as late as the first quarter of 2017.
Reports have surfaced that the new Intel Skylake CPUs and LGA 1151 motherboard sockets can be damaged by excessive pressure applied by third-party CPU coolers. Intel is investigating now.
Intel has launched its 2nd generation Xeon Phi coprocessor, codenamed Knights Landing. The company also officially announced the Omni-Path Architecture, its new, proprietary interconnect technology. Read on for more details.
Mr. Gene Amdahl, who was credited for his pioneering efforts in building up IBM mainframe offerings, has passed away at age 92 last week. Find out more about his contributions to modern computing after the jump.
According to a former AMD employee, the company is busy getting its next generation Zen CPU ready for launch! Read on for more details about its new and improved microarchitecure.
PC case manufacturer Lian Li has entered new territory with its first CPU water cooling block.