Thursday, 11 Jul 2013
For the second consecutive week since Microsoft released the public preview of Windows 8.1, the company has delivered several bug fixes for the preview OS.
Wednesday, 10 Jul 2013
Yahoo has just announced built in Dropbox integration on its Yahoo Mail Android app. The integration allows Yahoo Mail users to easily send and receive large attachments like documents, photos and video using Dropbox.
Tuesday, 2 Jul 2013
Apple finally reached a deal with Taiwan Semiconductor Manufacturing (TSMC) to make chips for its products starting in 2014.
Monday, 1 Jul 2013
A recent Federal Communications Commission (FCC) listing reveals the specs of an upcoming ASUS K009 tablet, which is marked "nexus" for "marketing purpose".
Tuesday, 25 Jun 2013
HP has announced the launch of new consumer products, including notebooks, tablets, detachables, and All-in-One PCs.
Monday, 24 Jun 2013
A touch-enabled notebook that pivots to let users share their work and folds to go mobile as a tablet, the 11.6-inch HP EliteBook Revolve comes powered by Intel Ivy Bridge processors and is optimized for the Windows 8 platform.
Friday, 21 Jun 2013
Samsung led the industry today with the launch of the world's slimmest Windows 8 tablet measuring only 8.2mm thin. More details inside!
Samsung today revealed an Intel-based convertible tablet that runs both Windows 8 and Android operating systems simultaneously. Known as the ATIV Q, this tablet will also come with the world's highest resolution screen.
Wednesday, 19 Jun 2013
Today at CommunicAsia 2013, Panasonic launched the JT-B1 Toughpad for Asia-Pacific, a 7-inch rugged tablet operating on Android Ice Cream Sandwich. The JT-B1 is US Military MIL-STD-810G and IP65 certified making it resistant to dust, water, shock, humidity, temperature and drops of up to 1.5m.
Tuesday, 18 Jun 2013
The manufacturers of Gorilla Glass, Corning, has just announced that they're working on a flexible version of Gorilla Glass. This new glass, called Willow Glass, will enable hardware manufacturers to create not only thinner devices, but also devices with unconventional form factors.