- Mobile Phones
Friday, 10 Aug 2012
China Labor Watch, the group who investigated Foxconn's purportedly harsh working conditions recently, is now after another Chinese facility, HEG Electronics, for flouting China's labor laws with their employment of child labor and student labor exploitation. Samsung will look into the matter with immediate effect.
Following an earlier leaked WP8 line-up, WPDang has added allegations that HTC will be launching new Windows Phone 8 devices in the third week of September.
Wednesday, 8 Aug 2012
According to a report by a Chinese language newspaper, the upcoming next-gen iPhone is said to be only 7.6mm thick, 18 percent thinner than the iPhone 4S.
Tuesday, 7 Aug 2012
According to SamMobile, insiders have said that the Korean company has already started testing Jelly Bean on their popular flagship smartphone, the Samsung Galaxy S III and its predecessor, the Galaxy S II.
Photos of the alleged nano SIM tray and home button for the upcoming iPhone have made its way on the Internet, GSMArena reports.
Apple and Google confirms that iOS 6 will see the demise of the native YouTube app. Google will instead work on a standalone version of the YouTube app for iOS 6 users.
Monday, 6 Aug 2012
In its ongoing trial with Samsung, Apple is forced to reveal secrets regarding how the iPhone was conceived and how the design team worked, giving a rare insight into how the ultra-secretive company conducts its business.
Saturday, 4 Aug 2012
The successor to Galaxy Note has been confirmed for an appearance at Samsung's August 29th Mobile Unpacked event, Reuters reports. On the other hand, press invites for the Samsung event in New York on the 15th tease with a picture of a tablet-like device with ink scribbles around it.
Friday, 3 Aug 2012
Samsung is sending out invites for its upcoming Mobile Unpacked event at IFA 2012. The event is scheduled on 29 August in Berlin.
Samsung has just announced the production of ultra-fast embedded memory for smartphones, tablets, and other mobile devices. It is the first chip maker to support the latest JEDEC e-MMC v4.5 specification that standardizes more features for enhanced performance, efficiency, security, and reliability.