Friday, 20 Jul 2012
Micron has announced the high-volume availability of its 45-nanometer (nm) phase-change memory PCM for feature phones. The company said that it has plans to offer its PCM solutions to smartphones and tablet manufacturers. Read on for more details about this flash-alternative memory technology.
Thursday, 5 Jul 2012
Memory maker Micron is intending to buy ailing Japanese DRAM competitor Elpida for US$2.5 billion. The move will propel Micron's market share from 12.2% to 24.8%, moving it from fourth place to second place, just behind Samsung.
Tuesday, 3 Jul 2012
Samsung has unveiled its 16GB DDR4 DRAM modules. They are manufactured using the 30nm-class fabrication process and they mark the company's steady progress in establishing itself in the premium memory market.
Monday, 18 Jun 2012
The 16GB DDR3-1600 high-speed server memory module supports the latest Intel Quad-Channel Xeon E5-2600/4600 series and AMD Quad-Channel Opteron 6000 series server platforms, and is compatible with the latest Intel/AMD 2-way server platforms.
Thursday, 7 Jun 2012
While Corsair has a fairly wide product refresh this time at Computex, their key highlights are its new Neutron series SSD units, the AX1200i digital ATX PSU and the Dominator Platinum memory. Read on to to get a quick update.
Wednesday, 6 Jun 2012
The Viper 3 Series comes in a customized four color lineup - Black Mamba, Venom Red, Sapphire Blue, and Jungle Green - to provide solid performance in the most demanding computing environments.
Monday, 4 Jun 2012
Kingston has introduced their new HyperX dual-channel kits built specially for the new Intel third generation Core i7 and i5 processors. Kingston HyperX memory is available in 16GB and 8GB kits of two at 1600MHz, 2133MHz, 2400MHz and soon to be speedy 2666MHz frequencies.
Wednesday, 9 May 2012
According to Micron, DDR4 memory will be available for devices as early as next year. The company expects to begin volume production by the end of this year.
Tuesday, 17 Apr 2012
Kingston introduces its new packaging for the system-specific memory modules for Apple, Dell, HP, Lenovo, Sony, and Toshiba notebooks.
Tuesday, 20 Mar 2012
Equipped with Apacer's exclusively designed 3D heatspreader, heat can be transmitted effectively, achieving the most optimal heat dissipation effect within a limited size.