Wednesday, 3 Apr 2013
The Hybrid Memory Cube Consortium (HMCC) has announced its new DRAM memory architecture, called the Hybrid Memory Cube (HMC) technology, which is touted to improve performance over standard DDR3 and DDR4 DRAM while simultaneously reducing power consumption.
Monday, 1 Apr 2013
Kingston has announced the all-new black printed circuit boards (PCB) on two of its product lines - HyperX Beast and HyperX black.
Friday, 8 Feb 2013
Micron Technology has unveiled its new single-sided DDR3 DRAM module that has a reduced height of only 3mm. This translates to a 35% reduction from the standard DDR3 SODIMM. The new single-sided DRAM module also features DDR3L-RS components for lower power consumption.
Tuesday, 15 Jan 2013
Kingmax has officially launched its ECC DDR3 SO-DIMM memory, designed for the fast-growing micro server market.
Tuesday, 8 Jan 2013
Kingston celebrates the 10th anniversary of its HyperX product line at CES 2013 by releasing a special anniversary edition memory module.
Wednesday, 5 Dec 2012
Apacer introduces their new ARMOR Series DDR3 overclocking memory modules with colors to match users' motherboards.
Thursday, 18 Oct 2012
Patriot Memory has announced its new ULP (ultra-low power) Memory for Ultrabook SODIMM modules, offering users an option to upgrade their ultrabooks for increased performance and productivity.
Monday, 10 Sep 2012
Kingston has introduced its all-new packaging for the system-specific memory modules for ASUS and Acer notebooks.
My Passport for Mac, portable hard drives from Western Digital have been upgraded. The product line now boasts more capacity options and also come fitted with USB 3.0 technology.
Friday, 31 Aug 2012
Kingston has just announced that their HyperX red series is now a permanent addition to the entry-level HyperX blu product line, and not just a limited edition offering. These heatspreaders allow greater heat dissipation to help maintain optimal system performance.