Tuesday, 17 Jan 2017
The Raspberry Pi Foundation releases Compute Module 3, with its sights set on industrial applications
The Raspberry Pi Foundation has just released Compute Module 3 (CM3), with its sights set on IoT and automation applications. Based on the Raspberry Pi 3, there will be two versions of CM3, so read on for more details!
Saturday, 7 Jan 2017
Starting this year, ARM chips like the Qualcomm Snapdragon 835 will be supported by Windows 10. ARM chips could usher in a new breed of devices with excellent battery life, and Qualcomm thinks this could be the shot in the arm the flagging PC industry needs.
Friday, 6 Jan 2017
Intel unveiled a credit card sized compute platform at CES 2017 that could revolutionize the way compute and connectivity can be integrated to almost anything in the near future.
Thursday, 5 Jan 2017
Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) is reportedly on track to produce 7nm at full capacity in early 2018.
Wednesday, 4 Jan 2017
The Snapdragon 835 is the successor to 2016’s Snapdragon 820 and 821 chips, and offers a slew of improvements like faster performance, a gigabit-class LTE modem, better battery life, and beefed-up imaging and virtual reality capabilities.
Wednesday, 21 Dec 2016
The G.Skill Trident Z RGB is a DDR4 RAM stick with on-board RGB lighting. It offers full-length RGB illumination, with the flexibility to customize its colors through proprietary software.
Sunday, 18 Dec 2016
Here's your chance to recycle and donate your used computing devices at participating Newstead Technologies retail outlets for the company's Gift Your Tech social campaign. If the devices aren't in working order, the campaign will ensure of their proper disposal according to strict NEA regulations. Read on for more details!
Tuesday, 13 Dec 2016
TSMC has announced plans to build a US$15.7 billion foundry to actively focus on next-generation 5nm and 3nm process nodes.
Thursday, 8 Dec 2016
At WinHEC, Microsoft has announced that Windows 10 is coming to ARM through a partnership with Qualcomm.
Friday, 18 Nov 2016
Qualcomm and Samsung collaborated to manufacture the latest Snapdragon 835 chipset, which is built on the latter's 10-nanoeter (nm) FinFET process.