HTC: 10 Years of Innovation & Technology Leadership

A Continuation of Partnership with Qualcomm

A Continuation of Partnership with Qualcomm

In conjunction with its 10th anniversary celebrations, HTC announced that partnership with its long-time wireless solution provider, Qualcomm, will continue to grow and that it is looking forward to more good years of innovation ahead. In his opening speech, Mr. Peter Chou, CEO of HTC, added that Qualcomm's leadership in advanced wireless and data technology, particularly CDMA and 3G, has been and will continue to be pivotal to HTC's growth and future product developments. The announcement to further continue its partnership with Qualcomm Incorporated was expected by most industry observers due to the enduring win-win nature of the relationship and the fact that both companies still continue to share a common vision for the future of wireless telecommunication and Internet mobility.

A string of strong sales performances has seen the Taiwan-based company grown from a humble start-up with only a couple of employees in 1997 to become the world's largest manufacturer of Windows Mobile devices with more than 6,000 employees on its payroll worldwide. For the uninitiated, HTC was the manufacturer of popular handhelds such as the O2 XD/XDA II, XDA II mini, Dopod 838 Pro, HP hw6500 series, Orange SPV E200 and Qtek S200.

Following his words of thanks to Qualcomm, Mr. Peter Chou wasted no time in putting words into action by revealing to the media that HTC will be looking to release no less than 10 new devices by the end of 2007. As you might have guessed, these new devices will be based on Qualcomm's latest dual-core chipsets, the Mobile Station Modem (MSM) MSM7500 and MSM7200 solutions, and as a result, HTC will be the first company in the world to utilize these cutting-edge technologies.

 Left to right: Mr. Peter Chou, CEO of HTC and Dr. Paul E. Jacobs, CEO of Qualcomm.

The MSM7xxx series of chipsets from Qualcomm is the first in the industry to integrate two distinct processors into a single chip that handles modem and multimedia functions separately, bringing with it promises of better processing power, bigger data bandwidth and smaller, slimmer smartphone form factors - by as much as 30% from existing designs. The new chips also boast richer multimedia capabilities such as VGA video decoding and encoding, camera support of up to 8 megapixels, and 3D graphics.

Worthy to note is that the MSM7500 and MSM7200 cater for CDMA2000 1xEV-DO and HSPA markets respectively while a third, in the form of the MSM7600, will support both CDMA2000 1xEV-DO and HSPA markets. To HTC, the significance of these chipsets is that it provides more headroom for developing devices of varying form factors to meet customers' needs. This flexibility in product design has already empowered HTC to release products such as the Mogul, HTC 6800, HTC 5800 and HTC TyTN II (Kaiser), which made its worldwide debut in Europe late last month - much to the excitement of customers.

"Qualcomm is pleased to continue our long relationship with HTC with these latest innovative devices utilizing our industry-leading mobile broadband and multimedia technologies," said Dr. Paul E. Jacobs, CEO of Qualcomm. "Our MSM7200 chipset, powering the latest UMTS Smartphones from HTC, will prove to be as compelling a combination as our previous successes with the popular MSM7500-based HTC 5800 and 6800 CDMA2000 Smartphones that are now shipping across North America."

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